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1.
Biomacromolecules ; 23(3): 960-971, 2022 03 14.
Artigo em Inglês | MEDLINE | ID: mdl-35029369

RESUMO

As a natural antitumor drug, curcumin (CUR) has received increasing attention from researchers and patients due to its various medicinal properties. However, currently CUR is still restricted due to its low and stand-alone therapeutic effects that seriously limit its clinical application. Here, by using cellulose nanocrystals (CNCs) as a nanocarrier to load CUR and AuNPs simultaneously, we developed a hybrid nanoparticle as a codrug delivery system to enhance the low and stand-alone therapeutic effects of CUR. Aided with the encapsulation of ß-cyclodextrin (ßCD), both the solubility and the stability of CUR are greatly enhanced (solubility increased from 0.89 to 131.7 µg/mL). Owing to the unique rod-like morphology of CNCs, the system exhibits an outstanding loading capacity of 31.4 µg/mg. Under the heat effects of coloaded AuNPs, the system demonstrates a high release rate of 77.63%. Finally, with CNC as a bridge nanocarrier, all aforementioned functions were integrated into one hybrid nanoparticle. The all-in-one integration ensures CUR to have enhanced therapeutic effects and enables the delivery system to exhibit combined chemo-photothermal therapy outcomes. This work presents a significant step toward CUR's clinical application and provides a new strategy for effective and integrative treatment of tumor disease.


Assuntos
Curcumina , Nanopartículas Metálicas , Nanopartículas , Curcumina/química , Portadores de Fármacos/química , Ouro/química , Humanos , Nanopartículas/química , Terapia Fototérmica
2.
Carbohydr Polym ; 273: 118539, 2021 Dec 01.
Artigo em Inglês | MEDLINE | ID: mdl-34560951

RESUMO

Flexible touch screen panel (f-TSP) has been emerging recently and metallic nanowire transparent conductive electrodes (TCEs) are its key components. However, most metallic nanowire (MNW) TCEs suffer from weak bonding strength between metal nanowire electrode layers and polymer substrates, which causes delamination of TCEs and produces serious declines in durability of f-TSPs. Here, we introduce AgS bonding and develop tough and strong electrode-substrate bonded MNW TCEs, which can enhance durability of f-TSPs significantly. We used silver nanowires (AgNWs) as metal conductive electrode and thiol-modified nanofibrillated cellulose (NFC-HS) nanopaper as substrates. Because of the existence of Ag from AgNWs and S from NFC-HS, strong AgS bonding was generated and tough TCEs were obtained. The TCEs exhibit excellent electrical stability, outstanding optical and electrical properties. The f-TSP devices integrated with the TCEs illustrate striking durability. This technique may provide a promising strategy to produce flexible and tough TCEs for next-generation high-durability f-TSPs.

3.
Carbohydr Polym ; 266: 118175, 2021 Aug 15.
Artigo em Inglês | MEDLINE | ID: mdl-34044963

RESUMO

Polymer-based thermal insulation films are widely utilized to reduce the influence of solar radiation. However, current thermal insulation films face several challenges from poor thermal insulation performance and severe environmental pollution, which are caused by the non-disintegratability of polymer substrates. Here, cellulose nanofiber (CNF)/antimony tin oxide (ATO) hybrid films with and without polyvinyl alcohol (PVA) are presented and they can be used as window thermal barrier films and personal thermal management textiles. The hybrid films exhibit prominent thermal insulation performance, blocking 91.07% ultraviolet(UV) light, reflecting 95.19% near-infrared(NIR) light, and transmitting 44.89% visible(VIS) light. Meanwhile, the hybrid films demonstrate high thermal stability, high anti-UV aging stability, and robust mechanical properties. Moreover, the used-up hybrid films based on natural cellulose are of high disintegratability and recyclability. Our present work is anticipated to open up a new avenue for the fabrication of next-generation high-performance thermal insulation films with sustainable and environmentally friendly processes.

4.
Macromol Rapid Commun ; 41(19): e2000292, 2020 Oct.
Artigo em Inglês | MEDLINE | ID: mdl-32833274

RESUMO

Flexible electronics require its substrate to have adequate thermal stability, but current thermally stable polymer substrates are difficult to be disintegrated and recycled; hence, generate enormous electronic solid waste. Here, a thermally stable and green solvent-disintegrable polymer substrate is developed for flexible electronics to promote their recyclability and reduce solid waste generation. Thanks to the proper design of rigid backbones and rational adjustments of polar and bulky side groups, the polymer substrate exhibits excellent thermal and mechanical properties with thermal decomposition temperature (Td,5% ) of 430 °C, upper operating temperature of over 300 °C, coefficient of thermal expansion of 48 ppm K-1 , tensile strength of 103 MPa, and elastic modulus of 2.49 GPa. Furthermore, the substrate illustrates outstanding optical and dielectric properties with high transmittance of 91% and a low dielectric constant of 2.30. Additionally, it demonstrates remarkable chemical and flame resistance. A proof-of-concept flexible printed circuit device is fabricated with this substrate, which demonstrates outstanding mechanical-electrical stability. Most importantly, the substrate can be quickly disintegrated and recycled with alcohol. With outstanding thermally stable properties, accompanied by excellent recyclability, the substrate is particularly attractive for a wide range of electronics to reduce solid waste generation, and head toward flexible and "green" electronics.


Assuntos
Eletrônica , Polímeros , Eletricidade , Solventes , Temperatura
5.
ACS Appl Mater Interfaces ; 12(8): 9701-9709, 2020 Feb 26.
Artigo em Inglês | MEDLINE | ID: mdl-32013388

RESUMO

Flexible organic light-emitting diode (OLED) devices based on polymer substrates have attracted worldwide attention. However, the current OLED polymer substrates are limited due to weak thermal stability, which is not compatible with the high temperature in OLED fabrication. Here, we developed a novel nanocellulose/polyarylate (PAR) hybrid polymer substrate with both high transparency and excellent thermal properties. Benefiting from the nanometer scale of the cellulose nanofibrils (CNFs) and the efficient interfacial interaction with PAR, the substrate exhibited greatly improved thermal stability, with a glass transition temperature of 192 °C, the thermal decomposition temperature of 501 °C, and upper operating temperature up to over 220 °C. Meanwhile, the hybrid substrate exhibits outstanding mechanical properties. Notably, no apparent transparency loss was observed after the CNF addition, and the hybrid substrate maintains a high transmittance of 85% and a low haze of 1.75%@600 nm. Moreover, OLED devices fabricated on the hybrid substrates exhibit a much improved optoelectrical performance than that of the devices fabricated on the conventional poly(ethylene terephthalate) (PET) substrates. We anticipate this research will open up a new route for fabricating flexible high-performance OLEDs.

6.
ACS Appl Mater Interfaces ; 11(22): 20281-20290, 2019 Jun 05.
Artigo em Inglês | MEDLINE | ID: mdl-31083900

RESUMO

For flexible electronics, the substrates play key roles in ensuring their performance. However, most substrates suffer from weak bonding with the conductive ink and need additional aids. Here, inspired by the Ag-S bond theory, a novel cellulose nanopaper substrate is presented to improve the bond strength with the Ag nanoparticle ink through a facile printing method. The substrate is fabricated using thiol-modified nanofibrillated cellulose and exhibits excellent optical properties (∼85%@550 nm), ultra-small surface roughness (3.47 nm), and high thermal dimensional stability (up to at least 90 °C). Most importantly, it can attract Ag nanoparticles initiatively and bind them firmly, which enable the conductive ink to be printed without using the ink binder and form a strong substrate-ink bonding and maintain a stable conductivity of 2 × 10-4 Ω cm even after extensive peeling and bending. This work may lead to exploring new opportunities to fabricate high-performance flexible electronics using the newly developed nanopaper substrate.

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